The product properties are designed so that they are suitable for all common processing/soldering processes (manual, wave, and reflow soldering) on circuit boards. The interaction of signal and power is covered by the model series in the small grid of 2.5 mm for high packing density up to the powerful 16 mm 2 conductor.
Large grid dimensions permit applications up to 1000 V, for example, for solar technology. Various proven connection technologies are used here, depending on the conductor type in question. What they all have in common is that they all reduce stress and loading on PCBs, they require low operating forces, and provide a vibration-proof, quick and maintenance-free connection.